IEC 60749-25 Ed. 1.0 b:2003
- standard by International Electrotechnical Commission, 07/11/2003
- Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
- Category: IEC
$95.00
$48.00
Full Description
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
Product Details
- Edition:
- 1.0
- Published:
- 07/11/2003
- Number of Pages:
- 25
- File Size:
- 1 file , 650 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
