IEC 62769-4 Ed. 2.0 b:2021
- standard by International Electrotechnical Commission, 02/05/2021
- Field Device Integration (FDI) - Part 4: FDI Packages
- Category: IEC
$417.00
$209.00
Full Description
IEC 62769-4:2021 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.
Product Details
- Edition:
- 2.0
- Published:
- 02/05/2021
- Number of Pages:
- 165
- File Size:
- 1 file , 4.3 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
Document History
