IEC 62769-6 Ed. 3.0 b:2023
- standard by International Electrotechnical Commission, 04/01/2023
- Field Device Integration (FDI) - Part 6: FDI Technology Mapping
- Category: IEC
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Full Description
This part of IEC 62769 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®1) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.
Product Details
- Edition:
- 3.0
- Published:
- 04/01/2023
- ISBN(s):
- 9782832264775
- Number of Pages:
- 18
- File Size:
- 1 file , 550 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
Document History
