IEC 62769-8 Ed. 1.0 b:2023
- standard by International Electrotechnical Commission, 04/01/2023
- Field device integration (FDI®) – Part 8: EDD to OPC-UA Mapping
- Category: IEC
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Full Description
This part of IEC 62769 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.
Product Details
- Edition:
- 1.0
- Published:
- 04/01/2023
- ISBN(s):
- 9782832267929
- Number of Pages:
- 110
- File Size:
- 1 file , 2.4 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
