IEEE 1301.2-1993

The purpose of this recommended practice is to give guidance in the implementation of the generic standard, IEEE Std 1301-1991 , and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992 . This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989) , including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm. The coordination dimensions given in IEEE Std 1301-1991 , for heights, widths, and depths for a mechanical structure lie within a homogeneous, metric, modular, three-dimensional grid as specified in IEC 917 (1988) . Applications of different connector families with pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm developed from IEEE Std 1301-1991 must all accept the same backplane grid of 0.5 mm in order to standardize manufacturing and test equipment and allow the mixing of different connector families on the same backplane. Optimum conditions are thereby created for the application of computer-assisted methods throughout design and manufacturing, such as computer-assisted planning, development, manufacturing, testing, and installation.